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| 1. general description the tja1054a is the interfac e between the protoc ol controller and the physical bus wires in a controller area netw ork (can). it is primarily intend ed for low-speed applications up to 125 kbd in passenger cars. the device provides differential receive and transmit capability but will switch to single-wire transm itter and/or receiver in error conditions. the tja1054a is the electrostatic dischar ge (esd) improved version of the tja1054. the tja1054at is, as the tja1054t, pin and downwards compatible with the pca82c252t and the tja1053t. this means th at these two devices can be replaced by the tja1054at or the tja1054t with retention of all functions. the most important improvements of the tja1054 and the tja1054a with respect to the pca82c252 and the tja1053 are: ? very low electromagnetic emission (eme) due to a very good matching of the canl and canh output signals ? good electromagnetic emission (emi ), especially in low power modes ? full wake-up capabilit y during bus failures ? extended bus failure management including sh ort-circuit of the canh bus line to v cc ? support for easy system fault diagnosis ? two-edge sensitive wake-up input signal via pin wake 2. features and benefits 2.1 optimized for in-car low-speed communication ? baud rate up to 125 kbd ? up to 32 nodes can be connected ? supports unshielded bus wires ? very low electromagnetic emission (eme) due to built-in slope control function and a very good matching of the canl and canh bus outputs ? good electromagnetic immunity (emi) in normal operating mode and in low power modes ? fully integrated receiver filters ? transmit data (txd) dominant time-out function 2.2 bus failure management ? supports single-wire transmission modes with ground offset voltages up to 1.5 v tja1054a fault-tolerant can transceiver rev. 5 ? 3 august 2010 product data sheet
tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 2 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver ? automatic switching to single -wire mode in the event of bus failures, even when the canh bus wire is short-circuited to v cc ? automatic reset to differential mode if bus failure is removed ? full wake-up capability during failure modes 2.3 protections ? bus pins short-circuit safe to battery and to ground ? thermally protected ? bus lines protected against transients in an automotive environment ? an unpowered node does not disturb the bus lines 2.4 support for low power modes ? low-current sleep mode and standby mode with wake-up via the bus lines ? power-on reset flag on the output 3. quick reference data [1] all parameters are guaranteed over the virtual junc tion temperature range by design, but only 100 % tested at t amb = 125 c for dies on wafer level, and above this for cased products 100 % tested at t amb =25 c, unless otherwise specified. [2] for bare die, all parameters are only guaranteed if the back side of the die is connected to ground. table 1. quick reference data v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = ? 40 c to +150 c; all voltages are defined with respect to ground; positive curre nts flow into the device; unless otherwise specified. [1] [2] [3] symbol parameter conditions min typ max unit v cc supply voltage 4.75 - 5.25 v v bat battery supply voltage on pin bat no time limit ? 0.3 - +40 v operating mode 5.0 - 27 v load dump - - 40 v i bat battery supply current on pin bat sleep mode; v cc =0v; v bat =12v -3050 a v canh voltage on pin canh v cc = 0 v to 5.0 v; v bat 0 v; no time limit; with respect to any other pin ? 27 - +40 v v canl voltage on pin canl v cc = 0 v to 5.0 v; v bat 0 v; no time limit; with respect to any other pin ? 27 - +40 v v canh voltage drop on pin canh i canh = ? 40 ma - - 1.4 v v canl voltage drop on pin canl i canl =40ma - - 1.4 v t r bus line output rise time between 10 % and 90 %; c1 = 10 nf; see figure 5 -0.6- s t f bus line output fall time between 10 % and 90 %; c1 = 1 nf; see figure 5 -0.3- s t vj virtual junction temperature [4] ? 40 - +150 c tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 3 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat =5.3vto27v (see table 5 ). [4] junction temperature in accordance with ?iec 60747-1? . an alternative definition is: t vj =t amb +p r th(vj-a) where r th(vj-a) is a fixed value to be used for the calculation of t vj . the rating for t vj limits the allowable combinations of power dissipation (p) and ambient temperature (t amb ). 4. ordering information 5. block diagram table 2. ordering information type number package name description version tja1054at so14 plastic small outline package; 14 leads; body width 3.9 mm sot108-1 tja1054at/s900 so14 plastic small outline pack age; 14 leads; body width 3.9 mm sot108-1 tja1054au - bare die; 1990 m 2730 m 375 m- fig 1. block diagram mgu383 failure detector plus wake-up plus time-out wake-up standby control inh 1 wake 7 stb 5 en 6 txd v cc v cc v cc 2 err 4 rxd 3 temperature protection driver receiver bat 14 v cc 10 13 gnd filter timer filter tja1054a 9 11 12 8 rtl canh canl rth tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 4 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 6. pinning information 6.1 pinning 6.2 pin description fig 2. pin configuration tja1054at inh bat txd gnd rxd canl err canh stb v cc en rtl wake rth 001aaf609 1 2 3 4 5 6 7 8 10 9 12 11 14 13 table 3. pin description symbol pin description inh 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs txd 2 transmit data input for activating the driver to the bus lines rxd 3 receive data output for readi ng out the data from the bus lines err 4 error, wake-up and power-on indication output; active low in normal operating mode when a bus failure is detected; active low in standby and sleep mode when a wake-up is detected; active low in power-on standby when a v bat power-on event is detected stb 5 standby digital control signal inpu t; together with the input signal on pin en this input determines the state of the transceiver; see table 5 and figure 3 en 6 enable digital control signal input; together with the input signal on pin stb this input determines the state of the transceiver; see table 5 and figure 3 wake 7 local wake-up signal input (active low); both falling and rising edges are detected rth 8 termination resistor connection; in case of a canh bus wire error the line is terminated with a predefined impedance rtl 9 termination resistor connection; in case of a canl bus wire error the line is terminated with a predefined impedance v cc 10 supply voltage canh 11 high-level can bus line canl 12 low-level can bus line gnd 13 ground bat 14 battery supply voltage tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 5 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 7. functional description the tja1054a is the interface between the can protocol controller and the physical wires of the can bus (see figure 7 ). it is primarily intended for low-speed applications, up to 125 kbd, in passenger cars. the device prov ides differential transmit capability to the can bus and differential receive capability to the can controller. to reduce eme, the rise and fall slopes are limited. this allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. moreover, the device supports transmission capability on either bus line if one of the wires is corrupted. the failure detection logic automatically selects a suitable transmission mode. in normal operating mode (no wir ing failures) the differential receiver is output on pin rxd (see figure 1 ). the differential receiver inputs are connected to pins canh and canl through integrated filters. the filtered input signals are also used for the single-wire receivers. the receivers connected to pins canh and canl have threshold voltages that ensure a maximum noise margin in single-wire mode. a timer function (txd dominant time-out func tion) has been integrated to prevent the bus lines from being driven into a permanent domi nant state (thus blocking the entire network communication) due to a situation in which pin txd is permanently forced to a low level, caused by a hardware and/or software application failure. if the duration of the low level on pin txd e xceeds a certain time, the transmitter will be disabled. the timer will be reset by a high level on pin txd. 7.1 failure detector the failure detector is fully active in the no rmal operating mode. after the detection of a single bus failure the detector switches to the appropriate mode (see ta b l e 4 ). the differential receiver threshold voltage is set at ? 3.2 v typical (v cc = 5 v). this ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 5 and 6a. these failures, or recovery from them, do not destroy ongoing transmissions. the output drivers remain active, the termination does not change and the receiver remains in differential mode (see ta b l e 4 ). failures 3, 3a and 6 are detected by comparat ors connected to the canh and canl bus lines. failures 3 and 3a are detected in a two-step approach. if the canh bus line exceeds a certain voltage level, the differenti al comparator signals a continuous dominant condition. because of inter operability reasons with the pr edecessor products pca82c252 and tja1053, after a first time-out the transceiver switches to single-wire operation through canh. if the canh bus lin e is still exceeding the canh detection voltage for a second time-out, the tja1054a switches to canl operation; the canh driver is switched off and the rth bias changes to the pull-down current source. the time-outs (delays) are needed to avoid false triggering by external rf fields. tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 6 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver [1] a weak termination implies a pul l-down current source behavior of 75 a typical. [2] a weak termination implies a pull-up current source behavior of 75 a typical. failure 6 is detected if the canl bus line exceeds its comparator threshold for a certain period of time. this delay is needed to avoid false triggering by external rf fields. after detection of failure 6, the reception is swit ched to the single-wire mode through canh; the canl driver is switched off and the rtl bi as changes to the pull-up current source. recovery from failure s 3, 3a and 6 is detected automatically after reading a consecutive recessive level by corresponding comparators for a certain period of time. failures 4 and 7 initially result in a permanent dominant level on pin rxd. after a time-out the canl driver is switched off and the rtl bias changes to the pull-up current source. reception continues by switching to the single-wire mode via pins canh or canl. when failures 4 or 7 are removed, the recessive bus levels are restored. if the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. if any of the wiring failure occurs, the output signal on pin err will be set to low. on error recovery, the output signal on pin err will be set to high ag ain. in case of an interrupted open bus wire, this failure will be detected a nd signalled only if there is an open wire between the transmitting and receiving node(s). thus, during open wire failures, pin err typically toggles. during all single-wire transmissions, elec tromagnetic compatibilit y (emc) performance (both immunity and emission) is worse than in the differential mode. the integrated receiver filters suppress any hf noise induced into the bus wires. the cut-off frequency of these filters is a compromise between propagation delay and hf suppression. in single-wire mode, lf noise cannot be distinguished from the required signal. table 4. bus failures failure description termination canh (rth) termination canl (rtl) canh driver canl driver receiver mode 1 canh wire interrupted on on on on differential 2 canl wire interrupted on on on on differential 3 canh short-circuited to battery weak [1] on off on canl 3a canh short-circuited to v cc weak [1] on off on canl 4 canl short-circuited to ground on weak [2] on off canh 5 canh short-circuited to ground on on on on differential 6 canl short-circuited to battery on weak [2] on off canh 6a canl short-circuited to v cc on on on on differential 7 canl and canh mutually short-circuited on weak [2] on off canh tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 7 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 7.2 low power modes the transceiver provides three low power mo des which can be entered and exited via stb and en (see ta b l e 5 and figure 3 ). the sleep mode is the mode with the lowest power consumption. pin inh is switched to high-impedance for deactivation of the external voltage regulator. pin canl is biased to the battery voltage via pin rtl. if the supply voltage is provided, pins rxd and err will signal the wake-up interrupt. the standby mode operates in the same way as the sleep mode but with a high level on pin inh. the power-on standby mode is the same as the standby mode, however, in this mode the battery power-on flag is shown on pin err instead of the wake-up interrupt signal. the output on pin rxd will show the wake-up interr upt. this mode is on ly for reading out the power-on flag. [1] if the supply voltage v cc is present. [2] wake-up interrupts are released when entering normal operating mode. [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat =5.3vto27v. [4] in case the goto-sleep command was used before. when v cc drops, pin en will become low, but due to the fail-safe functionality this does not effect the internal functions. [5] v bat power-on flag will be reset when entering normal operating mode. wake-up requests are recognized by the transceiver through two possible channels: ? the bus lines for remote wake-up ? pin wake for local wake-up in order to wake-up the transceiver remotely through the bus lines, a filter mechanism is integrated. this mechanism makes sure that noise and any present bus failure conditions do not result into an erroneous wake-up. becaus e of this mechanism it is not sufficient to simply pull the canh or canl bus lines to a dominant level for a certain time. to guarantee a successful remote wake-up under all conditions, a message frame with a dominant phase of at least the maximum specified t (canh) or t (canl) in it is required. table 5. normal operating and low power modes mode pin stb pin en pin err pin rxd pin rtl switched to low high low high goto-sleep command low high wake-up interrupt signal [1] [2] [3] wake-up interrupt signal [1] [2] [3] v bat sleep low low [4] standby low low power-on standby high low v bat power-on flag [1] [5] wake-up interrupt signal [1] [2] [3] v bat normal operating high high error flag no error flag dominant received data recessive received data v cc tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 8 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver a local wake-up through pin wake is detected by a rising or falling edge with a consecutive level exceeding the maximum specified t wake . on a wake-up request the transceiver will set th e output on pin inh to high which can be used to activate the external supply voltage regulator. if v cc is provided the wake-up request can be read on the err or rxd outputs, so the external microcontroller can activate the transceiver (switch to normal operating mode) via pins stb and en. to prevent a false remote wake-up due to transients or rf fields, the wake-up voltage levels have to be maintained for a certain period of time. in the low power modes the failure detection circuit remain s partly active to prevent an increased power consumption in the event of failures 3, 3a, 4 and 7. to prevent a false local wake-up during an open wire at pin wake , this pin has a weak pull-up current source towards v bat . however, in order to protect the transceiver against any emc immunity issues, it is recommended to connect a not used pin wake to pin bat. pin inh is set to floating only if the goto-sleep command is entered successfully. to enter a successful goto-sleep command under all conditions, this command must be kept stable for the maximum specified t h(sleep) . pin inh will be set to a high level again by the following events only: ? v bat power-on (cold start) ? rising or falling edge on pin wake ? a message frame with a dominant phase of at least the maximum specified t (canh) or t (canl) , while pin en or pin stb is at a low level ? pin stb goes to a high level with v cc active to provide fail-safe functiona lity, the signals on pins stb and en will internally be set to low when v cc is below a certain threshold voltage (v cc(stb) ). 7.3 power-on after power-on (v bat switched on) the signal on pin inh will become high and an internal power-on flag will be set. this flag can be read in the power-on standby mode through pin err (stb = high; en = low) and will be reset by entering the normal operating mode. 7.4 protections a current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. if the junction temperature exceeds the typical value of 165 c, the transmitter output stages are disabled. because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipat ion and hence a lower chip temperature. all other parts of t he device will continue to operate. the pins canh and canl are protected against electrical transients which may occur in an automotive environment. tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 9 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 8. limiting values mode 10 stands for: pin stb = high and pin en = low. (1) mode change via input pins stb and en. (2) mode change via input pins stb and en; it should be noted that in the sleep mode pin inh is inactive and possibly there is no v cc . mode control is only possible if v cc of the transceiver is active. (3) pin inh is activated after wake-up via bus input pin wake . (4) transitions to normal mode clear the internal wake-up: interrupt and battery fail flag are cleared. (5) transitions to sleep mode: pin inh is deactivated. fig 3. mode control mbk94 9 power-on standby 10 normal (4) 11 goto sleep (5) 01 standby 00 sleep 00 (1) (2) (3) table 6. limiting values in accordance with the absolute maximum rating system (iec 60134). [1] symbol parameter conditions min max unit v cc supply voltage ? 0.3 +6 v v bat battery supply voltage ? 0.3 +40 v v txd voltage on pin txd ? 0.3 v cc +0.3 v v rxd voltage on pin rxd ? 0.3 v cc +0.3 v v err voltage on pin err ? 0.3 v cc +0.3 v v stb voltage on pin stb ? 0.3 v cc +0.3 v v en voltage on pin en ? 0.3 v cc +0.3 v v canh voltage on pin canh with respect to any other pin ? 27 +40 v v canl voltage on pin canl with respect to any other pin ? 27 +40 v v trt(n) transient voltage on pins canh and canl see figure 6 ? 150 +100 v tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 10 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver [1] all voltages are defined with respect to pin gnd, unles s otherwise specified. positive current flows into the device. [2] only relevant if v wake tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 12 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver pins rxd and err v oh high-level output voltage on pin err i o = ? 100 av cc ? 0.9 - v cc v on pin rxd i o = ? 1ma v cc ? 0.9 - v cc v v ol low-level output voltage on pin err i o =1.6ma 0 - 0.4 v on pin rxd i o =7.5ma 0 - 1.5 v pin wake i il low-level input current v wake =0v; v bat =27v ? 10 ? 4 ? 1 a v th(wake) wake-up threshold voltage v stb = 0 v 2.5 3.2 3.9 v pin inh v h high-level voltage drop i inh = ? 0.18 ma - - 0.8 v | i l | leakage current sleep mode; v inh =0v - - 5 a pins canh and canl v canh voltage on pin canh v cc = 0 v to 5.0 v; v bat 0v; no time limit; with respect to any other pin ? 27 - +40 v v canl voltage on pin canl v cc = 0 v to 5.0 v; v bat 0v; no time limit; with respect to any other pin ? 27 - +40 v v canh voltage drop on pin canh i canh = ? 40 ma - - 1.4 v v canl voltage drop on pin canl i canl =40ma - - 1.4 v v th(dif) differential receiver threshold voltage no failures and bus failures 1, 2, 5 and 6a; see figure 4 v cc =5v ? 3.5 ? 3.2 ? 2.9 v v cc = 4.75 v to 5.25 v ? 0.70v cc ? 0.64v cc ? 0.58v cc v v o(reces) recessive output voltage v txd =v cc on pin canh r rth <4k --0.2v on pin canl r rtl <4k v cc ? 0.2 - - v v o(dom) dominant output voltage v txd =0v; v en =v cc on pin canh i canh = ? 40 ma v cc ? 1.4 - - v on pin canl i canl =40ma - - 1.4 v table 8. static characteristics ?continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = ? 40 c to +150 c; all voltages are defined with respect to ground; positive currents flow into t he device; unless otherwise specified. [1] [2] [3] symbol parameter conditions min typ max unit tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 13 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver i o(canh) output current on pin canh normal operating mode; v canh =0v; v txd =0v ? 110 ? 80 ? 45 ma low power modes; v canh =0v;v cc =5v - ? 0.25 - a i o(canl) output current on pin canl normal operating mode; v canl =14v; v txd =0v 45 70 100 ma low power modes; v canl =12v;v bat =12v -0- a v d(canh)(sc) detection voltage for short-circuit to battery voltage on pin canh normal operating mode; v cc =5v 1.5 1.7 1.85 v low power modes 1.1 1.8 2.5 v v d(canl)(sc) detection voltage for short-circuit to battery voltage on pin canl normal operating mode v cc = 5 v 6.6 7.2 7.8 v v cc = 4.75 v to 5.25 v 1.32v cc 1.44v cc 1.56v cc v v th(wake) wake-up threshold voltage on pin canl low power modes 2.5 3.2 3.9 v on pin canh low power modes 1.1 1.8 2.5 v v th(wake) difference of wake-up threshold voltages (on pins canl and canh) low power modes 0.8 1.4 - v v th(canh)(se) single-ended receiver threshold voltage on pin canh normal operating mode and failures 4, 6 and 7 v cc = 5 v 1.5 1.7 1.85 v v cc = 4.75 v to 5.25 v 0.30v cc 0.34v cc 0.37v cc v v th(canl)(se) single-ended receiver threshold voltage on pin canl normal operating mode and failures 3 and 3a v cc = 5 v 3.15 3.3 3.45 v v cc = 4.75 v to 5.25 v 0.63v cc 0.66v cc 0.69v cc v r i(canh)(se) single-ended input resistance on pin canh normal operating mode 110 165 270 k r i(canl)(se) single-ended input resistance on pin canl normal operating mode 110 165 270 k r i(dif) differential input resistance normal operating mode 220 330 540 k pins rth and rtl r sw(rtl) switch-on resistance on pin rtl normal operating mode; | i o | <10ma -50100 r sw(rth) switch-on resistance on pin rth normal operating mode; | i o | <10ma -50100 table 8. static characteristics ?continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = ? 40 c to +150 c; all voltages are defined with respect to ground; positive currents flow into t he device; unless otherwise specified. [1] [2] [3] symbol parameter conditions min typ max unit tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 14 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver [1] all parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at t amb = 125 c for dies on wafer level, and above this for cased products 100 % tested at t amb =25 c, unless otherwise specified. [2] for bare die, all parameters are only guaranteed if the back side of the die is connected to ground. [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat =5.3vto27v (see table 5 ). 11. dynamic characteristics v o(rth) output voltage on pin rth low power modes; i o =1ma - 0.7 1.0 v i o(rtl) output current on pin rtl low power modes; v rtl =0v ? 1.25 ? 0.65 ? 0.3 ma i pu(rtl) pull-up current on pin rtl normal operating mode and failures 4, 6 and 7 -75- a i pd(rth) pull-down current on pin rth normal operating mode and failures 3 and 3a -75- a thermal shutdown t j(sd) shutdown junction temperature 155 165 180 c table 8. static characteristics ?continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = ? 40 c to +150 c; all voltages are defined with respect to ground; positive currents flow into t he device; unless otherwise specified. [1] [2] [3] symbol parameter conditions min typ max unit table 9. dynamic characteristics v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = ? 40 c to +150 c; all voltages are defined with respect to ground; unless otherwise specified. [1] [2] [3] symbol parameter conditions min typ max unit t t(reces-dom) transition time for recessive to dominant (on pins canl and canh) between 10 % and 90 %; r = 100 ; c1 = 10 nf; c2 = not present; see figure 5 0.35 0.60 - s t t(dom-reces) transition time for dominant to recessive (on pins canl and canh) between 10 % and 90 %; r = 100 ; c1 = 1 nf; c2 = not present; see figure 5 0.2 0.3 - s t pd(l) propagation delay txd (low) to rxd (low) no failures and failures 1, 2, 5 and 6a; r = 100 ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present -0.751.5 s c1=c2=3.3nf - 1 1.75 s failures 3, 3a, 4, 6 and 7; r = 100 ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present -0.851.4 s c1=c2=3.3nf - 1.1 1.7 s tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 15 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver t pd(h) propagation delay txd (high) to rxd (high) no failures and failures 1, 2, 5 and 6a; r = 100 ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present -1.21.9 s c1=c2=3.3nf - 2.5 3.3 s failures 3, 3a, 4, 6 and 7; r = 100 ; see figure 4 and figure 5 c1 = 1 nf; c2 = not present -1.11.7 s c1=c2=3.3nf - 1.5 2.2 s t r bus line output rise time between 10 % and 90 %; c1 = 10 nf; see figure 5 -0.6- s t f bus line output fall time between 10 % and 90 %; c1 = 1 nf; see figure 5 -0.3- s t react(sleep) reaction time of goto-sleep command [4] 5- 50 s t dis(txd) disable time of txd permanent dominant timer normal operating mode; v txd =0v 0.75 - 4 ms t dom(canh) dominant time for remote wake-up on pin canh low power modes; v bat =12v [4] 7- 38 s t dom(canl) dominant time for remote wake-up on pin canl low power modes; v bat =12v [4] 7- 38 s t wake required time on pin wake for local wake-up low power modes; v bat = 12 v; for wake-up after receiving a falling or rising edge [4] 7- 38 s t det failure detection time normal operating mode failures 3 and 3a 1.6 - 8.0 ms failures 4, 6 and 7 0.3 - 1.6 ms low power modes; v bat =12v failures 3 and 3a 1.6 - 8.0 ms failures 4 and 7 0.1 - 1.6 ms table 9. dynamic characteristics ?continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = ? 40 c to +150 c; all voltages are defined with respect to ground; unless otherwise specified. [1] [2] [3] symbol parameter conditions min typ max unit tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 16 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver [1] all parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at t amb = 125 c for dies on wafer level, and above this for cased products 100 % tested at t amb =25 c, unless otherwise specified. [2] for bare die, all parameters are only guaranteed if the back side of the die is connected to ground. [3] a local or remote wake-up event will be signalled at the transceiver pins rxd and err if v bat =5.3vto27v (see table 4 ). [4] to guarantee a successful mode transition under all conditions, the maximum spec ified time must be applied. t rec failure recovery time normal operating mode failures 3 and 3a 0.3 - 1.6 ms failures 4 and 7 7 - 38 s failure 6 125 - 750 s low power modes; v bat =12v failures 3, 3a, 4 and 7 0.3 - 1.6 ms n det pulse-count failure detection difference between canh and canl; normal operating mode and failures 1, 2, 5 and 6a; pin err becomes low -4- n rec number of consecutive pulses for failure recovery on canh and canl simultaneously; failures1,2,5and6a -4- table 9. dynamic characteristics ?continued v cc = 4.75 v to 5.25 v; v bat = 5.0 v to 27 v; v stb =v cc ; t vj = ? 40 c to +150 c; all voltages are defined with respect to ground; unless otherwise specified. [1] [2] [3] symbol parameter conditions min typ max unit v diff =v canh ? v canl fig 4. timing diagram for dynamic characteristics 015aaa17 6 ? 5 v ? 3.2 v 2.2 v 0.7v cc 0.3v cc 0 v 5 v 1.4 v 3.6 v 0 v v cc v txd v canl v canh v can v rxd t pd(l) t pd(h) tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 17 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 12. test information termination resistors r1 (100 ) are not connected to pin rth or pin rtl for testing purposes because the minimum load allow ed on the can bus lines is 500 per transceiver. the capacitive bus load of 10 nf is split into 3 equal capacitors (3.3 nf) to simulate the bus cable. fig 5. test circuit for dynamic characteristics the waveforms of the applied transients on pi ns canh and canl will be in accordance with ?iso 7637 part 1? : test pulses 1, 2, 3a and 3b. fig 6. test circuit for automotive transients mgu38 1 20 pf rxd en stb txd wake 7 2 5 6 3 inh bat v cc 11410 gnd err 13 4 rtl rth 8 9 canl 12 canh 11 + 5 v r1 c1 c2 r1 c1 tja1054a mgu382 20 pf rxd en stb txd wake 7 2 5 6 3 inh bat v cc 11410 gnd err 13 4 rtl rth 8 9 canl 12 canh 11 + 5 v + 12 v 1 nf 10 f generator 1 nf 1 nf 1 nf 125 125 511 511 tja1054a tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 18 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 12.1 quality information this product has been qualified to the appropriate automotive electronics council (aec) standard q100 or q101 and is suitable for use in automotive applications. fig 7. application diagram mgu38 0 100 nf txd rxd stb err en inh 2 7 35461 tja1054a can transceiver bat v cc v dd gnd 14 10 13 wake p8xc592/p8xce598 can controller ctx0 crxo px.x px.x px.x 811129 rtl canl canh rth can bus line + 5 v + 5 v battery v bat tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 19 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 13. package outline fig 8. package outline sot108-1 (so14) unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot108-1 x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 7 8 1 14 y 076e06 ms-012 pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 99-12-27 03-02-19 0 2.5 5 mm scale s o14: plastic small outline package; 14 leads; body width 3.9 mm sot108 -1 tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 20 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 14. bare die outline [1] all coordinates ( m) represent the position of the center of each pad with respect to the bottom left-hand corner of the top aluminium layer (see figure 9 ). table 10. bonding pad locations symbol pad coordinates [1] x y inh 1 106 317 txd 2 111 168 rxd 3 750 111 err 4 1347 111 stb 5 2248 103 en 6 2551 240 wake 7 2559 381 rth 8 2463 1443 rtl 9 2389 1840 v cc 10 1886 1809 canh 11 900 1698 canl 12 401 1698 gnd 13a 80 1356 gnd 13b 80 1241 bat 14 105 772 fig 9. bonding pad locations tja1054au 1 2 3 4 5 6 7 8 9 10 11 12 14 13 a 13 b mgu38 4 y 2730 m x 0 0 1990 m tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 21 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 15. soldering of smd packages this text provides a very brief insight into a complex technology. a more in-depth account of soldering ics can be found in application note an10365 ?surface mount reflow soldering description? . 15.1 introduction to soldering soldering is one of the most common methods through which packages are attached to printed circuit boards (pcbs), to form electr ical circuits. the soldered joint provides both the mechanical and the electrical connection. th ere is no single sold ering method that is ideal for all ic packages. wave soldering is often preferred when through-hole and surface mount devices (smds) are mixed on one printed wiring board; however, it is not suitable for fine pitch smds. reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 15.2 wave and reflow soldering wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. the wave soldering process is suitable for the following: ? through-hole components ? leaded or leadless smds, which are glued to the surface of the printed circuit board not all smds can be wave soldered. packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. also, leaded smds with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased pr obability of bridging. the reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. leaded packages, packages with solder balls, and leadless packages are all reflow solderable. key characteristics in both wave and reflow soldering are: ? board specifications, in cluding the board finish , solder masks and vias ? package footprints, including solder thieves and orientation ? the moisture sensitivit y level of the packages ? package placement ? inspection and repair ? lead-free soldering versus snpb soldering 15.3 wave soldering key characteristics in wave soldering are: ? process issues, such as application of adhe sive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave ? solder bath specifications, including temperature and impurities tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 22 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 15.4 reflow soldering key characteristics in reflow soldering are: ? lead-free versus snpb solderi ng; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see figure 10 ) than a snpb process, thus reducing the process window ? solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board ? reflow temperature profile; this profile includ es preheat, reflow (in which the board is heated to the peak temperature) and coolin g down. it is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). in addition, the peak temperature must be low enough that the packages and/or boards are not damaged. the peak temperature of the package depends on package thickness and volume and is classified in accordance with ta b l e 11 and 12 moisture sensitivity precautions, as indicat ed on the packing, must be respected at all times. studies have shown that small packages reach higher temperatures during reflow soldering, see figure 10 . table 11. snpb eutectic process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 < 2.5 235 220 2.5 220 220 table 12. lead-free process (from j-std-020c) package thickness (mm) package reflow temperature ( c) volume (mm 3 ) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 23 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver for further information on temperature profiles, refer to application note an10365 ?surface mount reflow soldering description? . 16. appendix 16.1 overview of differences between the tja1054 and the tja1054a [1] the bonding pad coordinates partly differ between the tja1054 and the tja1054a. msl: moisture sensitivity level fig 10. temperature profiles for large and small components 001aac84 4 temperature time minimum peak temperature = minimum soldering temperature maximum peak temperature = msl limit, damage level peak temperature table 13. characteristics symbol parameter conditions tja1054 tja1054a unit min max min max v canh canh bus line voltage ? 40 +40 ? 27 +40 v v canl canl bus line voltage ? 40 +40 ? 27 +40 v v esd electrostatic discharge voltage human body model pins rth, rtl, canh and canl ? 2+2 ? 4+4kv all other pins ? 2+2 ? 2+2kv machine model any pin ? 100 +100 ? 150 +150 v table 14. bare die parameter tja1054 tja1054a unit dimensions 1990 2700 1990 2730 m bonding pad coordinates [1] [1] tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 24 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 17. abbreviations 18. revision history table 15. abbreviations acronym description can controller area network emc electromagnetic compatibility eme electromagnetic emission emi electromagnetic immunity esd electrostatic discharge table 16. revision history document id release date data sheet status change notice supersedes tja1054a v.5 20100803 product data sheet - tja1054a_4 modifications: ? value of parameter v esd (machine model) changed in ta b l e 6 and ta b l e 1 3 . ? typing error corrected in table 8 in the conditions column for i bat . tja1054a_4 20070102 product data sheet - tja1054a_3 tja1054a_3 (9397 750 11722) 20040323 product specif ication - tja1054a_2 tja1054a_2 (9397 750 09321) 20020211 product specif ication - tja1054a_1 tja1054a_1 (9397 750 08254) 20010820 preliminary specification - - tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 25 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver 19. legal information 19.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 19.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 19.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification. tja1054a all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 5 ? 3 august 2010 26 of 27 nxp semiconductors tja1054a fault-tolerant can transceiver bare die ? all die are tested on compliance with their related technical specifications as stated in this data sheet up to the point of wafer sawing and are handled in accordance with the nxp semiconductors storage and transportation conditions. if there are da ta sheet limits not guaranteed, these will be separately indicated in the data sheet. there are no post-packing tests performed on individual die or wafers. nxp semiconductors has no control of third party procedures in the sawing, handling, packing or assembly of the die. accordingly, nxp semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing, handling, packing or assembly of the die. it is the responsibility of the customer to test and qualify their application in which the die is used. all die sales are conditioned upon and subject to the customer entering into a written die sale agreement with nxp semiconductors through its legal department. quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comp lete, exhaustive or legally binding. 19.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 20. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors tja1054a fault-tolerant can transceiver ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 august 2010 document identifier: tja1054a please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 21. contents 1 general description . . . . . . . . . . . . . . . . . . . . . . 1 2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 optimized for in-car low-speed communication . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 bus failure management. . . . . . . . . . . . . . . . . . 1 2.3 protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.4 support for low power modes . . . . . . . . . . . . . . 2 3 quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 ordering information . . . . . . . . . . . . . . . . . . . . . 3 5 block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 functional description . . . . . . . . . . . . . . . . . . . 5 7.1 failure detector. . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2 low power modes . . . . . . . . . . . . . . . . . . . . . . 7 7.3 power-on . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 7.4 protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 8 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 thermal characteristics . . . . . . . . . . . . . . . . . 10 10 static characteristics. . . . . . . . . . . . . . . . . . . . 11 11 dynamic characteristics . . . . . . . . . . . . . . . . . 14 12 test information . . . . . . . . . . . . . . . . . . . . . . . . 17 12.1 quality information . . . . . . . . . . . . . . . . . . . . . 18 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 19 14 bare die outline . . . . . . . . . . . . . . . . . . . . . . . . 20 15 soldering of smd packages . . . . . . . . . . . . . . 21 15.1 introduction to soldering . . . . . . . . . . . . . . . . . 21 15.2 wave and reflow soldering . . . . . . . . . . . . . . . 21 15.3 wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 15.4 reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 16 appendix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 16.1 overview of differences between the tja1054 and the tja1054a . . . . . . . . . . . . . 23 17 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 24 18 revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 19 legal information. . . . . . . . . . . . . . . . . . . . . . . 25 19.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 19.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 19.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 19.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 26 20 contact information. . . . . . . . . . . . . . . . . . . . . 26 21 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 |
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